![reflow profile reflow profile](https://www.rehm-group.com/fileadmin/_processed_/c/5/csm_Hermes_750x750_ef7bc93b77.jpg)
The profiles can be measured in a loaded or unloaded state by either processing boards ahead of and behind the thermocoupled board to simulate the load or by sending the thermocouple board through alone for an unloaded test. The attached thermocouples can be measured by trailing the wires through the oven while processing or using a recording device that can be passed through the reflow oven by use of an insulating cover. Placing multiple thermocouples in differing locations and on different types of components on the board will give you the most comprehensive understanding of the thermal profile. Best practices for attaching thermocouples also suggest using strain relief to prevent the TC’s from being pulled off the board when the wires are tugged. Aluminum or Kapton tape can be used to attach thermocouples, but is not suggested due to trapped air and loosening of the tape’s adhesive. These thermocouples are attached using solder or epoxy.
#REFLOW PROFILE HOW TO#
How to Profile a Solder Reflow OvenĪ solder reflow oven is profiled by attaching thermocouples (TC’s) to the board that is being processed. The difference between the reflow oven set points, or recipe, and the thermal profile is governed by the laws of heat transfer and is affected by mass (weight of the product), surface area, thickness, and the heat capacity (the ability of a material to absorb or give up heat). The temperature settings combined with the belt speed, and the convection rate settings, will produce the thermal profile on the board or product. The recipe is the temperature settings of the reflow oven in each zone. A thermal profile is a measurement of the temperature, of the product, during thermal processing. So we now have a set of temperature values for every 30 seconds of the profile but the firmware on the oven, the procedure for inputting a custom reflow profile expects data points every 10 seconds so we need to somehow extrapolate our values to generate more points in between.The thermal profile is an critical consideration in the solder reflow process.
![reflow profile reflow profile](https://www.cruiseandferry.net/Portals/0/EasyGalleryImages/1/10696/Scandlines-zero-emission_web.jpg)
Then I added these lines to plot the absolute values on the Y axis. First I added a scale on the Y axis with a line at each 5 points. Inside the datasheet we can find the recommended graph, it’s an unusually small one for this paste but luckily we can zoom in and increase the size of the graph.Īt this point I recommend you grab a screenshot of this profile and import it into your favorite img editing tool because we need to draw some lines on this graph to extract some values.
#REFLOW PROFILE SERIES#
For this example let’s assume we are working with the NP545 series from Kester, we need the datasheet of this product to check out the recommended reflow profile. Before doing any actual configuration on the oven you need to start with the specs of your solder paste. So in this video I’m gonna show you how to define a custom reflow profile in the open source unified engineering firmware. I also mentioned that there is an option to configure a custom reflow profile with this oven and that’s probably something you’re gonna have to use sooner or later because there are so many options of solder paste on the market and not only that but also there is variation between different ovens so it’s likely you’re gonna have to tweak that. In the last video I showed you how I upgraded the T-962 oven to fix some of the issues that were present on this oven. Phil on Voltlog #274 – Installing Traccar GPS Tracking Server On A Raspberry Pi.Zach t on Voltlog #207 – Making a DIY Spot Welder From A Microwave Transformer.Mick Burrell on Voltlog #255 – Gophert NPS-1601 Review (possibly the best power supply in this price range).
#REFLOW PROFILE SERIAL#